SF1000 Thermal Pad 10.0W/m·K – Ultimate Thermal Solution for GaN Systems & AI Computing

The SF1000 thermal silicone pad (10.0W/m·K) is a top-tier thermal interface material designed for high-power-density applications, delivering effective thermal management solutions for high-frequency GaN power devices and efficient cooling solutions for AI server clusters. It excels in thermal management applications under extreme environments, making it ideal for thermal interface materials in military electronic equipment and heat dissipation requirements for quantum computing systems, ensuring stable performance in high-temperature and high-power scenarios.

Key Features:

10.0W/m·K ultra-high thermal conductivity
High-temperature resistance (-40°C to 125°C)
High dielectric strength and mechanical stability
Customizable sizes and thicknesses

Key Features & Benefits:

Reliable Thermal Conductivity: Offers a thermal conductivity of 1.5 W/m·K, effectively managing heat in a wide range of general-purpose applications.
Excellent Electrical Insulation: Features high dielectric strength, preventing short circuits and enhancing the safety and reliability of your electronic assemblies.
Soft & Compressible: The soft silicone material conforms well to uneven surfaces, ensuring good interfacial contact and low thermal resistance with minimal assembly pressure.
Easy to Handle & Install: Comes in sheets or pre-cut sizes, allowing for simple, clean, and efficient manual or semi-automated installation, reducing production time.
Durable & Long-Lasting: Provides long-term stability against aging, drying out, or pump-out, ensuring consistent performance over the product’s lifespan.

Typical Applications:

LED Lighting: Heat dissipation for LED drivers, PCBs, and low-power lamp housings.
Power Supplies: Thermal management for transformers, low-power MOS tubes, and components within AC-DC adapters.
Consumer Electronics: Cooling for set-top boxes, home appliances, and battery packs.
Automotive Electronics: Auxiliary heat dissipation for control modules and infotainment systems.

Specifications Table:

Property	Value/Specification	Test Method	Notes / Significance
Thermal Properties
Thermal Conductivity	10.0 W/m·K	ASTM D5470	Core performance metric for heat transfer capability.
Thermal Resistance	< 0.5 °C-in²/W	ASTM D5470	Depends on thickness and pressure; lower is better.
Physical Properties
Available Thickness	0.5 – 5.0mm	–	Custom thicknesses available upon request.
Thickness Tolerance	±0.1 mm	–	Ensures consistent gap filling.
Hardness	Shore OO 50 (±10)	ASTM D2240	Measures softness; ideal for fragile components.
Compression Set	< 20% (22 hrs @ 70°C)	ASTM D395	Indicates long-term resilience and stress relaxation.
Density	3.3 g/cm³	–	–
Electrical Properties
Dielectric Strength	≥ 6.0 kV/mm	ASTM D149	High voltage breakdown resistance for safety.
Volume Resistivity	≥ 1.5 x 10¹³ Ω·cm	ASTM D257	Excellent electrical insulation properties.
Reliability & Stability
Continuous Operating Temp.	-40 °C to +125 °C	–	Suitable for most general applications.
UL 94 Rating	V-0	UL 94	Certified flame retardant for enhanced safety.
Service Life	> 100,000 hours @ 105°C	–	Predicts long-term reliability under stress.

The SF105 is the ideal, cost-effective thermal interface material for your projects that do not require high thermal performance but demand dependable insulation and basic heat dissipation.