In electronic packaging, mechanical and thermal challenges are inextricably linked. A Thermal Interface Material, by occupying space between components with […]
Most TIM analysis focuses on steady-state performance—dissipating a constant heat load. However, a growing class of electronics, from automotive lidar to
A Thermal Interface Material (TIM) datasheet is your primary tool for selection, but it can be a mix of essential
The quest for higher thermal conductivity in TIMs has pushed filler technology from micro-scale to nano-scale. Incorporating fillers like carbon nanotubes
On the factory floor, the bill-of-materials (BOM) cost of a Thermal Interface Material is just the entry fee. Its real
Operating at temperatures near absolute zero (from 4K to 77K) is not just “very cold.” It’s a different physical regime
When heat fluxes exceed 100 W/cm², traditional finned heatsinks reach their limit. Solutions like direct-to-chip liquid cold plates and vapor chambers become
The push for a circular economy in electronics collides with the reality of modern Thermal Interface Materials (TIMs). Their very
Every engineer knows surface roughness affects TIM performance, but the common specification of “Ra < 1.6 µm” is dangerously insufficient. Ra is
Not all TIM failures are thermal or mechanical. Some of the most insidious are chemical, arising from silent interactions between the
Computational Fluid Dynamics (CFD) is a powerful tool for thermal design, but its accuracy hinges on the quality of input
In high-frequency electronics, the Thermal Interface Material is not just a thermal pathway—it becomes part of the electromagnetic environment. A TIM
