The continuous push toward higher output powers in semiconductor laser systems has created heat flux densities that challenge the fundamental […]
The industry’s shift toward 2.5D and 3D integrated circuit (IC) packaging, combining multiple silicon dies, high-bandwidth memory (HBM), and interposers,
Electronics deployed in harsh environments including automotive, aerospace, and industrial applications experience mechanical stress, thermal cycling, and chemical exposure that
The convergence of photonics and electronics in next-generation computing and communication systems creates unique thermal management challenges at optical-electronic interfaces
Energy generation systems including gas turbines, solid oxide fuel cells, and concentrated solar power plants operate at temperatures exceeding 500°C
Radio frequency and microwave systems require dynamic thermal management solutions that can adapt to varying power levels and operating conditions
The advancement of quantum computing systems operating at millikelvin temperatures presents unprecedented thermal management challenges, particularly in managing heat transfer
The electronics industry faces growing pressure to develop sustainable alternatives to conventional petroleum-based thermal interface materials while maintaining or improving
As power electronics advance toward unprecedented power densities exceeding 500W/cm², conventional thermal interface materials approach fundamental performance limits. This research
Medium voltage power conversion systems (1-10kV) for industrial drives, renewable energy, and traction applications demand thermal interface materials that combine
Modern pulsed power systems, including radar transmitters, particle accelerators, and high-energy pulsed lasers, generate extreme transient thermal loads that conventional
Traditional thermal interface materials rely on random particle distributions that limit their ultimate performance potential. This research presents a paradigm
