Beyond electrons and phonons, a third carrier—the spin of an electron—offers a revolutionary path to control heat. Emerging research explores spintronic caloric effects within […]
Modern electronics face a critical challenge: brief, intense power bursts that exceed the steady-state cooling capacity, causing thermal throttling or
Evolution has optimized biological systems for efficient mass and heat transfer under constraints of minimal material and energy. By mimicking
Imagine a Thermal Interface Material (TIM) that doesn’t just conduct heat, but actively controls its path—directing it away from sensitive
What if a Thermal Interface Material (TIM) could heal itself? Micro-cracks from thermal stress, delamination from vibration, or minor pump-out
The future of high-performance computing and electric vehicles demands thermal systems that adapt. Imagine a Thermal Interface Material (TIM) whose
In applications where heat is generated in microsecond bursts, the initial temperature spike is not governed by steady-state thermal conductivity,
When a Thermal Interface Material (TIM) is electrically conductive or becomes slightly conductive due to moisture absorption, it can create
At the nanoscale, heat is not a fluid but a vibration—carried by quantized lattice waves called phonons. The ultimate limit on
The microscopic world where a Thermal Interface Material (TIM) meets a substrate is governed by surface energy—a fundamental property that
Most TIM failures are detected too late—when temperature spikes or the device fails. Acoustic Emission (AE) monitoring offers a paradigm shift: listening
When a Thermal Interface Material (TIM) is placed under constant compressive load—as it is in every heatsink assembly—it doesn’t just
