Phase Change Thermal Interface Materials (PCM TIMs)

Discover our advanced Phase Change Thermal Interface Materials engineered for high-performance computing and power electronics. These specialized materials transition from solid to liquid at operational temperatures, creating a near-perfect thermal interface that eliminates air gaps and provides lower thermal resistance than traditional pastes or pads. Ideal for CPU/GPU cooling, server applications, and automotive power modules where reliability and maximum heat transfer are critical. Explore superior thermal stability and long-term performance without pump-out or dry-out issues.